Exploring Novel Materials and Advanced Fabrication Techniques for Micro- and Nanosystems

blended course

Course Summary

Theme 1: Novel Materials and Characterization
Emerging 2D Materials: Exploring the synthesis and properties of novel two-dimensional materials like graphene, transition metal dichalcogenides (TMDs), and phosphorene for advanced nanoscale applications.
Advanced Characterization Techniques: Delving into cutting-edge techniques such as scanning probe microscopy, electron microscopy, and spectroscopy to characterize the structural and electronic properties of nanomaterials with high precision.
Quantum Materials: Investigating the unique quantum mechanical properties of materials, including topological insulators and quantum dots, and their potential for next-generation electronics and quantum computing.
Metamaterials and Plasmonics: Researching metamaterials with engineered electromagnetic properties and plasmonic materials for manipulating light at the nanoscale, opening up possibilities for ultra-compact photonic devices.
Nanomaterials for Energy: Studying the development of nanomaterials for energy harvesting, thermoelectric materials, and energy storage devices to address energy harvesting and storage challenges.
Theme 2: Fabrication Processes of Micro- and Nano-Systems and their Integration into Devices
Microfabrication Techniques: Exploring microfabrication methods such as photolithography, etching, and thin-film deposition for creating miniaturized electronic and MEMS (Micro-Electro-Mechanical Systems) components.
Nanomanufacturing: Investigating advanced nanomanufacturing processes like nanoimprint lithography, directed self-assembly, and molecular assembly for precise nanostructure fabrication.
MEMS and NEMS Devices: Researching the design, fabrication, and integration of Micro-Electro-Mechanical Systems (MEMS) and Nano-Electro-Mechanical Systems (NEMS) devices for various applications, from sensors to actuators.
Photonics Integration: Exploring fabrication processes and techniques for integrating photonic components into micro- and nano-systems, enabling advancements in optical communication, sensors, and signal processing.
Advanced Packaging and Interconnects: Exploring innovations in packaging technologies and interconnect solutions for enhancing the performance and reliability of micro- and nano-systems, especially in electronics and photonics applications.

Target group

All the interested PhD and postdocs, companies, and ZAP members across various disciplines including mechanical, materials, electrical and chemical engineering, physics, chemistry, and medical sciences involved in any of the above-mentioned topics.

Credits info

the number of hours attended will be confirmed via official certificates.

Fee info

EUR 300: early bird registration.
EUR 400: late registration.

Scholarships

NA